The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Jan. 28, 2015
Applicant:

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Inventors:

Shunsuke Mochizuki, Tokyo, JP;

Kazuya Kitagawa, Tokyo, JP;

Yoji Shirato, Tokyo, JP;

Keita Nagahashi, Tokyo, JP;

Mika Tsuda, Tokyo, JP;

Satoshi Maji, Utsunomiya, JP;

Motomi Kurokawa, Aichi, JP;

Kazuya Hirasawa, Kariya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/49548 (2013.01); H01L 23/49568 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01);
Abstract

A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the thermosetting resin (A). In the thermally conductive sheet of the present invention, at a frequency of 1 kHz and at a temperature of 100° C. to 175° C., the maximum value of a dielectric loss factor of a cured product of the thermally conductive sheet is less than or equal to 0.030, and a change in relative dielectric constant of the cured product of the thermally conductive sheet is less than or equal to 0.10.


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