The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Dec. 06, 2016
Applicant:
Coriant Advanced Technology, Llc, New York, NY (US);
Inventor:
Nathan A. Nuttall, Castaic, CA (US);
Assignee:
Elenion Technologies, LLC, New York, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/552 (2006.01); G02B 6/42 (2006.01); H01L 23/48 (2006.01); H01L 25/16 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); G02B 6/4243 (2013.01); G02B 6/4274 (2013.01); H01L 23/373 (2013.01); H01L 23/481 (2013.01); H01L 23/552 (2013.01); H01L 25/167 (2013.01);
Abstract
A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.