The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Sep. 19, 2016
Applicant:
Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;
Inventors:
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/492 (2006.01); H01L 23/495 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); H01L 21/568 (2013.01); H01L 23/28 (2013.01); H01L 23/3107 (2013.01); H01L 23/3192 (2013.01); H01L 23/492 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/45 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85051 (2013.01); H01L 2224/85186 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract
The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.