The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Mar. 04, 2016
Asahi Glass Company, Limited, Chiyoda-ku, JP;
Wataru Kasai, Chiyoda-ku, JP;
Masami Suzuki, Chiyoda-ku, JP;
Asahi Glass Company, Limited, Chiyoda-ku, JP;
Abstract
A mold release film, which is excellent in releasability and capable of suppressing contamination of a mold or a resin-encapsulation portion by the mold release film and forming a resin-encapsulation portion excellent in adhesion to an ink layer, is provided. The mold release film is disposed on a cavity surface of a mold, in which a semiconductor element is disposed and encapsulated with a curable resin to form a resin-encapsulation portion. The mold release film has a first surface in contact with the curable resin when the resin-encapsulation portion is formed, and a second surface in contact with the cavity surface. At least the first surface is made of a fluororesin. The mold release film has an F/Al ratio of from 0.2 to 4, or an F/(C+F+O) ratio of from 0.1 to 0.3. A process for producing a semiconductor package using the mold release film is also provided.