The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Apr. 22, 2010
Applicants:
Yipeng Yan, Shanghai, CN;
Robert James Bogert, Lake Worth, FL (US);
Inventors:
Yipeng Yan, Shanghai, CN;
Robert James Bogert, Lake Worth, FL (US);
Assignee:
COOPER TECHNOLOGIES COMPANY, Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 17/04 (2006.01); H01F 27/24 (2006.01); H01F 1/26 (2006.01); H01F 41/02 (2006.01); H01F 1/14 (2006.01); H01F 1/147 (2006.01); H01F 1/153 (2006.01); H01F 1/37 (2006.01); H01F 3/10 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01F 1/26 (2013.01); H01F 17/04 (2013.01); H01F 41/0246 (2013.01); H01F 1/14 (2013.01); H01F 1/14758 (2013.01); H01F 1/14791 (2013.01); H01F 1/15375 (2013.01); H01F 1/37 (2013.01); H01F 3/10 (2013.01); H01F 27/255 (2013.01); H01F 27/2847 (2013.01); H01F 2017/046 (2013.01); H01F 2017/048 (2013.01);
Abstract
Magnetic component assemblies including moldable magnetic materials formed into magnetic bodies, at least one conductive coil, and termination features are disclosed that are advantageously utilized in providing surface mount magnetic components such as inductors and transformers.