The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Oct. 10, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Chang Yeon Won, Seoul, KR;

Hyun Phill Ko, Seongnam-si, KR;

Sung Ki Kim, Seoul, KR;

Jeong Mln Na, Seoul, KR;

Jae Moon Jo, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G10K 11/00 (2006.01); G10K 11/18 (2006.01); G01S 15/02 (2006.01); G01S 7/52 (2006.01); G01S 15/89 (2006.01); B06B 1/06 (2006.01); A61B 8/00 (2006.01);
U.S. Cl.
CPC ...
G10K 11/002 (2013.01); A61B 8/4483 (2013.01); B06B 1/0685 (2013.01); G01S 7/52079 (2013.01); G01S 15/02 (2013.01); G01S 15/8915 (2013.01); G10K 11/18 (2013.01); G01S 7/5208 (2013.01);
Abstract

The present disclosure provides a transducer support, ultrasound probe, and ultrasound imaging apparatus. The ultrasound transducer support includes a first layer having first areas in which heat transfer materials are arranged and second areas in which sound absorbent materials are arranged, the first and second areas being arranged alternately; and a second layer having third areas located below the first areas in which sound absorbent materials are arranged and fourth areas located below the second areas in which heat transfer materials are arranged.


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