The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Sep. 09, 2011
Applicants:
Myung Jun Kim, Seoul, KR;
Yun Gu Kang, Seoul, KR;
Myoung Soo Ahn, Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 1/04 (2006.01); F21V 8/00 (2006.01); G02F 1/1335 (2006.01); C09D 133/14 (2006.01); C08L 33/14 (2006.01); F21K 9/60 (2016.01); B29K 33/00 (2006.01);
U.S. Cl.
CPC ...
G02B 1/04 (2013.01); C08L 33/14 (2013.01); C09D 133/14 (2013.01); F21K 9/60 (2016.08); G02B 6/0055 (2013.01); G02B 6/0065 (2013.01); G02F 1/133615 (2013.01); B29K 2033/08 (2013.01); B32B 2457/202 (2013.01); G02B 6/0053 (2013.01);
Abstract
Provided is a method of fabricating a thick film of a large area substrate. The method of fabricating comprises applying a first rein on a base substrate to form a rein partition, and applying a second resin on an inner area formed by the resin partition. According to the present invention, by forming a first partition formed with resin when a film of a large area is coated and then by coating the film, uniformity and reliability of the coating can be improved.