The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Nov. 03, 2015
Applicant:

Paragon Semiconductor Lighting Technology Co., Ltd., New Taipei, TW;

Inventors:

Chia-Tin Chung, Miaoli County, TW;

Shen-Ta Yang, Taipei, TW;

Shiou-Liang Yeh, Taoyuan County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 3/02 (2006.01); F21S 8/06 (2006.01); F21V 17/02 (2006.01); F21V 17/06 (2006.01); F21V 21/112 (2006.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); F21V 29/70 (2015.01); F21V 29/89 (2015.01); F21K 9/20 (2016.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01); F21K 9/69 (2016.01);
U.S. Cl.
CPC ...
F21V 3/02 (2013.01); F21K 9/20 (2016.08); F21K 9/69 (2016.08); F21S 8/06 (2013.01); F21V 17/02 (2013.01); F21V 17/06 (2013.01); F21V 21/112 (2013.01); F21V 29/70 (2015.01); F21V 29/89 (2015.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01);
Abstract

A LED illumination device includes a carrier structure, a suspension structure, and a light-emitting structure. The carrier structure includes a carrier body and a first heat-conducting body fixedly disposed inside the carrier body. The carrier body has an outer thread structure disposed on an outer perimeter surface. The first heat-conducting body has a bottom contacting surface exposed from a bottom side of the carrier body. The suspension structure includes a first suspension element detachably disposed on a top side of the carrier body. The light-emitting structure includes a circuit substrate and a light-emitting unit. The circuit substrate is detachably disposed on the bottom side of the carrier body to contact the bottom contacting surface of the first heat-conducting body, and the light-emitting unit is disposed on the circuit substrate. Therefore, heat generated by the light-emitting unit is guided to the first heat-conducting body through the circuit substrate.


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