The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Aug. 27, 2009
Youhei Miwa, Toyohashi, JP;
Tadayoshi Saitou, Toyohashi, JP;
Masato Taguchi, Toyohashi, JP;
Mikihiro Uchizono, Toyohashi, JP;
Tetsuya Atsumi, Toyohashi, JP;
Tsutomu Ibuki, Toyohashi, JP;
Youhei Miwa, Toyohashi, JP;
Tadayoshi Saitou, Toyohashi, JP;
Masato Taguchi, Toyohashi, JP;
Mikihiro Uchizono, Toyohashi, JP;
Tetsuya Atsumi, Toyohashi, JP;
Tsutomu Ibuki, Toyohashi, JP;
MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;
MRC COMPOSITE PRODUCTS CO., LTD., Toyohashi-shi, JP;
Abstract
By completing curing in a short period of time even at low temperatures and using an epoxy resin composition as a matrix resin of a prepreg, it is possible to obtain a fiber-reinforced composite plastic product such as a fiber-reinforced tubular composite with excellent mechanical properties and, more particularly, excellent impact resistance. The epoxy resin composition includes A component, B component, C component, D component and E component, where the content rate of sulfur atoms is equal to or more than 0.2 wt % and equal to or less than 7 wt %, and the content rate of the C component is equal to or more than 1 wt % and equal to or less than 15 wt %. A component: epoxy resins, B component: reactive products of the epoxy resins and an amine compounds including the sulfur atom in a molecule (the unreacted epoxy resins and/or the amine compounds may be included), C component: polyamide compounds soluble in the A component, D component: urea compounds, and E component: dicyandiamide.