The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Sep. 02, 2014
Applicant:
The Trustees of Columbia University IN the City of New York, New York, NY (US);
Inventors:
Colin Nuckolls, New York, NY (US);
Michael Louis Steigerwald, Martinsville, NJ (US);
Xavier Roy, Brooklyn, NY (US);
Philip Kim, New York, NY (US);
Chulho Lee, New York, NY (US);
Seok Ju Kang, New York, NY (US);
Assignee:
The Trustees of Columbia University in the City of New York, New York, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/06 (2006.01); C07F 15/00 (2006.01); C07F 15/06 (2006.01); C01B 19/00 (2006.01); B82Y 10/00 (2011.01); C07F 11/00 (2006.01); C07F 15/04 (2006.01); H01B 1/12 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
C07F 15/06 (2013.01); B82Y 10/00 (2013.01); C01B 19/007 (2013.01); C07F 11/00 (2013.01); C07F 15/04 (2013.01); H01B 1/121 (2013.01); C01P 2002/72 (2013.01); C01P 2002/76 (2013.01); C01P 2002/77 (2013.01); C01P 2002/78 (2013.01); C01P 2002/82 (2013.01); C01P 2002/84 (2013.01); C01P 2004/02 (2013.01); C01P 2004/03 (2013.01); C01P 2006/32 (2013.01); C01P 2006/42 (2013.01); H01L 51/0046 (2013.01);
Abstract
A solid-state material comprising a solid-state compound is provided. The solid-state compound has the formula: [Cluster1][Cluster2], where Cluster1 can be a metal chalcogenide molecular cluster, Cluster2 a carbon cluster, and n the number of Cluster2 clusters in the solid-state compound. A method of forming a solid-state material is also provided.