The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
May. 09, 2011
Rodney L. Alley, Albany, OR (US);
Donald J. Milligan, Corvallis, OR (US);
Rodney L. Alley, Albany, OR (US);
Donald J. Milligan, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
The present disclosure includes bonded wafer structures and methods of forming bonded wafer structures. One example of a forming a bonded wafer structure includes providing a first wafer () and a second wafer () to be bonded together via a bonding process that has a predetermined wafer gap () associated therewith, and forming a mesa () on the first wafer () prior to bonding the first wafer () and the second wafer () together, wherein a height () of the mesa () is determined based on a target element gap () associated with the bonded wafer structure.