The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Sep. 18, 2011
Applicants:
Janusz Bryzek, Oakland, CA (US);
John Gardner Bloomsburgh, Oakland, CA (US);
Cenk Acar, Newport Coast, CA (US);
Inventors:
Janusz Bryzek, Oakland, CA (US);
John Gardner Bloomsburgh, Oakland, CA (US);
Cenk Acar, Newport Coast, CA (US);
Assignee:
Fairchild Semiconductor Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); H01L 29/84 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 3/0072 (2013.01); B81B 7/0016 (2013.01); B81B 7/0051 (2013.01); B81C 1/00238 (2013.01); B81C 1/00301 (2013.01); H01L 29/84 (2013.01); B81C 2201/019 (2013.01); B81C 2203/0785 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract
One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.