The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Aug. 12, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Masayuki Sakai, Matsumoto, JP;

Yasuo Inaoka, Shiojiri, JP;

Minoru Yajima, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B41J 2/161 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/19 (2013.01); Y10T 29/49401 (2015.01);
Abstract

Provided is a method for manufacturing a recording head having a head chip that ejects ink, an upstream flow path member, a downstream flow path member where an accommodating portion and a downstream flow path are disposed, a wiring member that is connected to a piezoelectric actuator in the head chip, a wiring substrate, a first insertion hole into which the wiring member and a tool are inserted, and a second insertion hole where a wiring member insertion portion into which the wiring member is inserted and a tool insertion portion into which the tool can be inserted are integrally formed, the method including inserting the tool into the tool insertion portion, holding the wiring member with the tool, withdrawing the tool from the tool insertion portion by moving the downstream flow path member to the head chip side, and inserting the wiring member into the wiring member insertion portion.


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