The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Dec. 25, 2012
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Masaru Tateyama, Nagoya, JP;
Masayuki Koshi, Nagoya, JP;
Assignee:
Toray Industries, Inc., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/02 (2006.01); B29C 51/10 (2006.01); B29C 51/00 (2006.01); B29K 81/00 (2006.01); B29K 23/00 (2006.01); B29K 77/00 (2006.01); B29K 67/00 (2006.01); B29K 33/04 (2006.01); B29K 55/02 (2006.01); B29K 69/00 (2006.01);
U.S. Cl.
CPC ...
B29C 51/002 (2013.01); B29K 2023/00 (2013.01); B29K 2033/04 (2013.01); B29K 2055/02 (2013.01); B29K 2067/00 (2013.01); B29K 2069/00 (2013.01); B29K 2077/00 (2013.01); B29K 2081/04 (2013.01);
Abstract
A method of manufacturing a thermoplastic resin molded article having a hollow portion includes setting a molded article (A) premolded from a thermoplastic resin in a first die, forming a melted thermoplastic resin plate (B) in a shape along an inner surface of a second die facing the first die by being attached to the inner surface of the second die by vacuum pressure, welding the thermoplastic resin plate (B) and the molded article (A) only in a predetermined region by mold-clamping the first die and the second die, and forming at least part of an unwelded region as a hollow portion.