The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Aug. 28, 2015
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Nobuo Ikemoto, Nagaokakyo, JP;
Makoto Osamura, Nagaokakyo, JP;
Satoshi Sasaki, Nagaokakyo, JP;
Yuki Wakabayashi, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 3/30 (2006.01); H01L 27/146 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H04N 5/225 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/301 (2013.01); H01L 24/81 (2013.01); H01L 27/14618 (2013.01); H04N 5/225 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); H05K 1/0296 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H05K 1/184 (2013.01); H05K 3/328 (2013.01); H05K 3/4617 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15162 (2013.01); H01L 2924/15787 (2013.01); H05K 1/186 (2013.01); H05K 3/403 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09454 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/063 (2013.01); Y10T 29/49146 (2015.01);
Abstract
A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.