The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Dec. 01, 2016
Applicants:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Pocons Co., Ltd., Gyeonggi-do, KR;

Inventors:

Byoung-ryoul Song, Gyeonggi-do, KR;

Eui-suck Sung, Gyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 9/00 (2006.01); H01R 4/48 (2006.01); H01R 13/6594 (2011.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01R 4/48 (2013.01); H01R 13/6594 (2013.01); H05K 3/325 (2013.01); H05K 9/0032 (2013.01); H05K 1/0215 (2013.01); H05K 3/4015 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10393 (2013.01);
Abstract

An electronic device is provided which includes a printed circuit board (PCB) including a non-conductive layer that forms at least a portion of a first surface, and a conductive layer arranged between the first surface and a second surface, an electronic component arranged on a first area of the first surface of the PCB, a conductive shield structure arranged on the PCB to cover the first area and the electronic component on the PCB, a support structure connected to the PCB and including a first part that faces a portion of one side of the conductive shield structure, and a cable extending along the one side of the conductive shield structure, inserted between the support structure and the portion of the one side of the conductive shield structure, and including at least one conductive line and an insulation layer that covers the at least one conductive line.


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