The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Oct. 28, 2014
Applicant:
Samsung Display Co., Ltd., Yongin, Gyeonggi-do, KR;
Inventors:
Jung-Hoon Ku, Chungcheongnam-do, KR;
Yong-Woo Koo, Gyeonggi-do, KR;
Ki-Yong Kim, Chungcheongnam-do, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Yongin, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); G01R 31/04 (2006.01); H05K 7/02 (2006.01); G02F 1/1345 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); G01R 31/048 (2013.01); G02F 1/13452 (2013.01); G02F 2201/36 (2013.01); H05K 3/3452 (2013.01); H05K 3/363 (2013.01); H05K 2203/125 (2013.01); H05K 2203/308 (2013.01);
Abstract
A printed circuit board includes a substrate and a plurality of pad forming regions disposed thereon. The plurality of pad forming regions are spaced apart from each other by a predetermined distance. A plurality of connection pads are disposed on a portion of the plurality of pad forming regions. The plurality of connection pads are configured to transmit or receive a signal to an external device or from the external device. The printed circuit board includes a path configured for the transportation of moisture therein.