The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Nov. 18, 2015
Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, Shandong, CN;
Hisense Usa Corp., Suwanee, GA (US);
Hisense International Co., Ltd., Qingdao, Shandong, CN;
Hao Wang, Shandong, CN;
Hongwei Mu, Shandong, CN;
YungLiang Huang, Shandong, CN;
Shun Zhang, Shandong, CN;
Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, CN;
Hisense USA Corp., Suwanee, GA (US);
Hisense International Co., Ltd., Qingdao, CN;
Abstract
A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.