The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

May. 10, 2016
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Anton Talalayev, San Jose, CA (US);

David H. Narajowski, Los Gatos, CA (US);

Christiaan A. Ligtenberg, San Carlos, CA (US);

Mahmoud R. Amini, Sunnyvale, CA (US);

William F. Leggett, San Jose, CA (US);

Mikael M. Silvanto, San Francisco, CA (US);

Christopher J. Stringer, Woodside, CA (US);

George Tziviskos, Cupertino, CA (US);

Edward Cooper, Campbell, CA (US);

Ron Alan Hopkinson, Cupertino, CA (US);

Ari Parsons Miller, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/648 (2006.01); H01R 24/60 (2011.01); H01R 13/6583 (2011.01); H01R 12/70 (2011.01);
U.S. Cl.
CPC ...
H01R 24/60 (2013.01); H01R 12/7082 (2013.01); H01R 13/6583 (2013.01);
Abstract

An interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.


Find Patent Forward Citations

Loading…