The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Oct. 04, 2016
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Chien-Wei Chiu, Beigang Township, TW;

Ching-Jong Chen, Magong, TW;

Fan Ho, New Taipei, TW;

Chien-Hsien Song, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/78 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01); H01L 29/40 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7816 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 29/0649 (2013.01); H01L 29/401 (2013.01); H01L 29/4916 (2013.01); H01L 29/66681 (2013.01);
Abstract

High-voltage semiconductor devices are provided. The high-voltage semiconductor device includes a substrate and an isolation structure in the substrate. The high-voltage semiconductor device includes a gate structure disposed on the substrate, wherein the gate structure is separated from the isolation structure by a distance. The high-voltage semiconductor device also includes a metal electrode disposed on the gate structure, wherein the metal electrode extends to directly above the isolation structure. The high-voltage semiconductor device further includes an interconnection structure including the lowest metal layer, wherein the metal electrode is between the lowest metal layer and the gate structure. Methods of manufacturing the high-voltage semiconductor device are also provided.


Find Patent Forward Citations

Loading…