The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Jul. 23, 2015
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventor:
Yukio Morita, Kyoto, JP;
Assignee:
KYOCERA Corporation, Kyoto-shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1515 (2013.01); H01L 2924/15738 (2013.01);
Abstract
A wiring board according to the present invention includes: an insulating base including a main face, a side face, and a notch portion opened in the main face and the side face; and an inner-face electrode disposed on the inner face of the notch portion and to be connected to an external circuit board with solder therebetween. In such a wiring board, the inner-face electrode contains nickel and gold at a surface portion thereof, more nickel than gold at a surface in an outer periphery section, and more gold than nickel at a surface in an inner region.