The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Jun. 17, 2016
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventor:
Nan-Jang Chen, Hsinchu, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/3114 (2013.01); H01L 23/49541 (2013.01); H01L 23/49544 (2013.01); H01L 23/49575 (2013.01); H01L 23/49589 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/45 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/45169 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14361 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1904 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01);
Abstract
A semiconductor package includes a die pad, a semiconductor die mounted on the die pad, a plurality of leads including a power lead disposed along a peripheral edge of the die pad, at least one connecting bar connecting the die pad, a power bar disposed on one side of the connecting bar, and a surface mount device (SMD) having a first terminal and a second terminal. The first terminal is electrically connected to the ground level through a first bond wire. The second terminal is electrically connected a power level through a second bond wire.