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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9852962 B1

PDFFull Text
Date of Patent:
Dec. 26, 2017

Filed:

Feb. 04, 2015

Waterproof electronic device and manufacturing method thereof

Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Hiroyuki Temmei, Tokyo, JP;

Mina Amo, Tokyo, JP;

Nobutake Tsuyuno, Tokyo, JP;

Eiichi Ide, Tokyo, JP;

Takeshi Tokuyama, Tokyo, JP;

Toshiya Satoh, Hitachinaka, JP;

Toshiaki Ishii, Tokyo, JP;

Kazuaki Naoe, Tokyo, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Khaja Ahmad

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/288 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/473 (2006.01); H05K 5/06 (2006.01); H05K 7/20 (2006.01); H01L 23/433 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 21/2885 (2013.01); H01L 21/565 (2013.01); H01L 23/295 (2013.01); H01L 23/3135 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/564 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H05K 5/065 (2013.01); H05K 7/20927 (2013.01); H01L 23/3107 (2013.01); H01L 23/49513 (2013.01); H01L 23/49586 (2013.01); H01L 24/45 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/17724 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/181 (2013.01);
Abstract

A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.

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