The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Mar. 17, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Evan George Colgan, Montvalle, NJ (US);
Michael Anthony Gaynes, Vestal, NY (US);
Katsuyuki Sakuma, Fishkill, NY (US);
Donald Alan Merte, Poughkeepsie, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/67 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3185 (2013.01); H01L 21/563 (2013.01); H01L 21/67126 (2013.01); H01L 2021/60022 (2013.01);
Abstract
Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.