The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Jan. 25, 2013
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yozo Matsuda, Utsunomiya, JP;

Noriyasu Hasegawa, Utsunomiya, JP;

Mitsuru Hiura, Utsunomiya, JP;

Tatsuya Hayashi, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 9/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); B29C 59/00 (2006.01); B29C 59/16 (2006.01); B29C 59/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 59/002 (2013.01); B29C 59/16 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 9/7003 (2013.01); G03F 9/7042 (2013.01); G03F 9/7065 (2013.01); B29C 2059/023 (2013.01);
Abstract

An imprint apparatus forms a pattern of a resin on a region to be processed of a substrate using a mold including a pattern region on which a pattern is formed and includes a correction unit configured to correct a shape of a target region that is either the pattern region on the mold or the region to be processed on the substrate, wherein the correction unit further includes: a heating unit configured to heat an object corresponding to the target region of either the mold or the substrate in a heating region having an area smaller than that of the pattern region on the mold; a scanning unit configured to scan the heating region with respect to the target region by changing the relative position of the target region and the heating region; and a control unit configured to acquire information regarding a correction deformation amount of the target region and control the heating unit and the scanning unit based on the information.


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