The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Oct. 15, 2013
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Noriyuki Sakuma, Tokyo, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A thermal type sensor molded from a mold resin having an opening has a problem in that the residual stress of the mold resin in the opening causes peeling at the interface having poor adhesion. A physical quantity sensor has a construction having a semiconductor chip having a detector unit, a frameon which the semiconductor chip is mounted, a mold resin portionwhich encapsulates the semiconductor chip and the frame and has an opening through which the detector unit is exposed to the outside, and a stress absorbing layerwhich is formed between an end of the opening in the mold resin portion and a wiring layer formed in the detector unit, and which is formed from a metal material that absorbs a stress from the end.