The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Mar. 05, 2014
Applicant:
Idemitsu Kosan Co., Ltd., Chiyoda-ku, JP;
Inventor:
Tomohiko Kitamura, Ichihara, JP;
Assignee:
IDEMITSU KOSAN CO., LTD., Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C10M 105/18 (2006.01); C10M 145/26 (2006.01); C10M 173/02 (2006.01); C10M 105/14 (2006.01); C10M 107/34 (2006.01); C10M 105/08 (2006.01);
U.S. Cl.
CPC ...
C10M 105/18 (2013.01); C10M 105/08 (2013.01); C10M 105/14 (2013.01); C10M 107/34 (2013.01); C10M 145/26 (2013.01); C10M 173/02 (2013.01); C10M 2207/022 (2013.01); C10M 2209/104 (2013.01); C10N 2220/021 (2013.01); C10N 2230/12 (2013.01); C10N 2240/401 (2013.01);
Abstract
A water-soluble working fluid of the invention is used for cutting a brittle material using a wire saw. The water-soluble working fluid is provided by blending water, alkylene oxide adduct of acethylene glycol, and glycols. The water-soluble working fluid of the invention is capable of providing favorable cutting accuracy when the brittle material is cut using a wire, and thus is suitable for cutting out a large-diameter wafer. The water-soluble working fluid of the invention is especially suitably applicable to an abrasive-grain-fixed wire saw.