The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Jun. 24, 2013
Applicant:

Kureha Corporation, Tokyo, JP;

Inventors:

Yusaku Inaba, Tokyo, JP;

Tamito Igarashi, Tokyo, JP;

Yuki Sakai, Tokyo, JP;

Aya Takeuchi, Tokyo, JP;

Assignee:

KUREHA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 127/16 (2006.01); C08K 3/22 (2006.01); H01M 2/14 (2006.01); C09D 7/12 (2006.01); H01M 2/16 (2006.01); H01M 10/052 (2010.01);
U.S. Cl.
CPC ...
C09D 127/16 (2013.01); C08K 3/22 (2013.01); C09D 7/1216 (2013.01); H01M 2/145 (2013.01); H01M 2/166 (2013.01); H01M 2/1653 (2013.01); H01M 2/1673 (2013.01); C08K 2003/2227 (2013.01); H01M 2/1646 (2013.01); H01M 2/1686 (2013.01); H01M 10/052 (2013.01); H01M 2220/20 (2013.01); Y02E 60/122 (2013.01); Y02P 70/54 (2015.11);
Abstract

An object of the present invention is to provide a filler-containing resin film in which shedding of inorganic materials or the like is suppressed, a resin composition that can be used in production of the filler-containing resin film, and a method for producing the filler-containing resin film. The filler-containing resin film of the present invention is a filler-containing resin film comprising: a vinylidene fluoride copolymer obtained by copolymerizing vinylidene fluoride and a compound represented by formula (1) (in formula (1), R, R, and Rare each independently hydrogen atoms, chlorine atoms, or alkyl groups having from 1 to 5 carbons; and X' is an atomic group having a molecular weight of 472 or less and having a main chain configured from 1 to 19 atoms); and an insulating inorganic filler. The resin film is produced by applying onto a substrate and then drying a resin composition containing the vinylidene fluoride copolymer, the insulating inorganic filler, and an organic solvent.


Find Patent Forward Citations

Loading…