IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9850380 B1

PDFFull Text
Date of Patent:
Dec. 26, 2017

Filed:

Oct. 26, 2015

Polyamide resin composition for molded article exposed to high-pressure hydrogen and molded article made of the same

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Daisuke Sato, Ichihara, JP;

Shinichiro Ochiai, Nagoya, JP;

Sadayuki Kobayashi, Nagoya, JP;

Assignee:

Toray Industries, Inc., , JP;

Attorney:

DLA Piper LLP (US)

Primary Examiner:

Kareen Thomas

Int. Cl.
CPC ...
F17C 1/02 (2006.01); C08L 77/02 (2006.01); C08L 23/26 (2006.01); C08L 77/06 (2006.01); F17C 1/16 (2006.01); B32B 27/34 (2006.01); C08J 5/00 (2006.01); F17C 13/04 (2006.01);
U.S. Cl.
CPC ...
C08L 77/02 (2013.01); B32B 27/34 (2013.01); C08J 5/00 (2013.01); C08L 23/26 (2013.01); C08L 77/06 (2013.01); F17C 1/16 (2013.01); F17C 13/04 (2013.01); B32B 2439/00 (2013.01); C08J 2377/02 (2013.01); C08J 2477/06 (2013.01); C08L 2205/025 (2013.01); F17C 2203/0604 (2013.01); F17C 2203/066 (2013.01); F17C 2203/0675 (2013.01); F17C 2205/0323 (2013.01); F17C 2221/012 (2013.01); F17C 2270/0184 (2013.01);
Abstract

A polyamide resin composition for a molded article exposed to high-pressure hydrogen contains a polyamide 6 resin (A) and a polyamide resin (B) having a melting point, as determined by DSC, that is not higher than a melting point of the polyamide 6 resin (A) +20° C. and a cooling crystallization temperature, as determined by DSC, that is higher than a cooling crystallization temperature of the polyamide 6 resin (A), the polyamide resin (B) present in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the polyamide 6 resin (A). The polyamide resin composition can provide a molded article having excellent weld properties and is less likely to suffer failure points despite repeated charging and discharging of high-pressure hydrogen.

Find Patent Forward Citations

Loading…