The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Sep. 02, 2015
Applicant:

Ihi Corporation, Koto-ku, JP;

Inventors:

Takahito Araki, Tokyo, JP;

Masaharu Yano, Tokyo, JP;

Kuniyuki Imanari, Tokyo, JP;

Kouta Ishitsu, Tokyo, JP;

Takashi Ueda, Ishikawa, JP;

Akira Hosokawa, Ishikawa, JP;

Tatsuaki Furumoto, Ishikawa, JP;

Assignee:

IHI Corporation, Koto-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 25/00 (2006.01); B23C 3/00 (2006.01); B23K 26/34 (2014.01); C04B 41/00 (2006.01); B23C 9/00 (2006.01); B23K 26/00 (2014.01); B23K 26/082 (2014.01); C04B 41/53 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C04B 41/0036 (2013.01); B23C 3/00 (2013.01); B23C 9/00 (2013.01); B23K 26/0006 (2013.01); B23K 26/0066 (2013.01); B23K 26/0093 (2013.01); B23K 26/082 (2015.10); B23P 25/006 (2013.01); C04B 41/009 (2013.01); C04B 41/53 (2013.01); B23C 2222/61 (2013.01); B23C 2226/18 (2013.01); B23C 2226/27 (2013.01); B23K 2203/52 (2015.10); Y10T 29/5107 (2015.01); Y10T 409/303808 (2015.01); Y10T 409/304032 (2015.01);
Abstract

A method for machining a ceramic matrix composite (CMC), the method enhancing a machining speed for the ceramic matrix composite (CMC), includes: a step of scanning an irradiated portion of a surface of a machining target material by a laser head to irradiate the irradiated portion with laser light from the laser head, and forming a deteriorated layer on the irradiated portion of the surface of the machining target material; and a step of sequentially removing the deteriorated layer by an end mill, the deteriorated layer being formed on the irradiated portion, wherein the deteriorated layer is formed by heating the irradiated portion up to a predetermined temperature by irradiation of continuous oscillation laser light, and by forming a crack by irradiation of pulsed oscillation laser light.


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