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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9849653 B1

PDFFull Text
Date of Patent:
Dec. 26, 2017

Filed:

Jan. 09, 2014

Mold release film and production method for same

Applicant:

Unitika Ltd., Hyogo, JP;

Inventors:

Goro Araki, Kyoto, JP;

Nobuyasu Okumura, Kyoto, JP;

Yoshimi Ueno, Kyoto, JP;

Assignee:

UNITIKA LTD., Hyogo, JP;

Attorney:

Fildes & Outland, P.C.

Primary Examiner:

Hui Chin

Int. Cl.
CPC ...
B32B 27/36 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); B32B 27/30 (2006.01); B05D 1/28 (2006.01); B05D 3/02 (2006.01); B05D 3/12 (2006.01); C08J 7/04 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B05D 1/28 (2013.01); B05D 3/0272 (2013.01); B05D 3/12 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); C08J 7/047 (2013.01); B32B 2307/748 (2013.01); B32B 2405/00 (2013.01); C08J 2367/02 (2013.01); C08J 2423/26 (2013.01); Y10T 428/31797 (2015.04);
Abstract

The present invention provides a mold release film including a resin layer provided on one surface of a polyester film, wherein the resin layer includes 100 parts by mass of a polypropylene-based modified polyolefin resin with the proportion of a modifying component of 1 to 10% by mass and 1 to 50 parts by mass of a cross-linking agent; the peel strength between the resin layer and a pressure-sensitive adhesive measured by bonding a rubber-based pressure-sensitive adhesive to the resin layer exceeds 3.0 N/cm; and the residual adhesion rate of a pressure-sensitive adhesive after bonding an acrylic pressure-sensitive adhesive to the resin layer is 80% or more.

Find Patent Forward Citations

Araki, Goro. (2017). Mold release film and production method for same (U.S. Patent No. 9849653). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9849653

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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