The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Jul. 12, 2013
Applicant:

Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;

Inventors:

Kenji Hirano, Osaka, JP;

Hiroyuki Hanato, Osaka, JP;

Takahiro Nakahashi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 71/02 (2006.01); B29C 71/00 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
B29C 71/02 (2013.01); B29C 71/0063 (2013.01); B29C 2071/022 (2013.01); B29K 2063/00 (2013.01);
Abstract

An annealing method according to the present invention is an annealing method of annealing a molded body () which is molded from a molding material in a molding step, and the method includes the steps of: (I) releasing stress from the molded body () by heating the molded body (); and (II) correcting a warp of the molded body (), by simultaneously heating the molded body () and applying a load to the molded body (). This achieves an annealing method which makes it possible to obtain a molded body that is free from residual stress and distortion.


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