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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9849632 B1

PDFFull Text
Date of Patent:
Dec. 26, 2017

Filed:

Dec. 02, 2014

Mold material, molding method, mold object, and molding apparatus

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Koki Hirata, Nagano, JP;

Assignee:

Seiko Epson Corporation, Tokyo, JP;

Attorney:

Global IP Counselors, LLP

Primary Examiner:

Fred M Teskin

Int. Cl.
CPC ...
B29C 67/00 (2017.01); B29C 67/04 (2017.01); C08L 33/12 (2006.01); B29C 64/135 (2017.01); B29C 64/165 (2017.01); C08J 5/00 (2006.01); B29K 105/00 (2006.01); B29K 105/16 (2006.01); B29K 101/10 (2006.01); B29K 101/12 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2015.01);
U.S. Cl.
CPC ...
B29C 67/0066 (2013.01); B29C 64/135 (2017.08); B29C 64/165 (2017.08); B29K 2101/10 (2013.01); B29K 2101/12 (2013.01); B29K 2105/0058 (2013.01); B29K 2105/16 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); C08L 2201/54 (2013.01); C08L 2205/22 (2013.01);
Abstract

A molding apparatus includes a heating section, a spreading section, a molding section, a drawing section and a curing section. The heating section which heats a mold material including particles and a binder agent which bonds together the particles, to a temperature equal to or higher than the melting point of the binder agent and forms a fluid mold material. The spreading section forms a mold layer by spreading the fluid mold material. The molding section layers the mold layers. The drawing section applies UV ink to a desired region of the mold layer. The curing section cures the UV ink applied to the desired region of the mold layer.

Find Patent Forward Citations

Hirata, Koki. (2017). Mold material, molding method, mold object, and molding apparatus (U.S. Patent No. 9849632). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9849632

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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