The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Jun. 12, 2014
Applicants:
Qingjun Zheng, Export, PA (US);
Robert J. Vasinko, Latrobe, PA (US);
Yixiong Liu, Greensburg, PA (US);
Inventors:
Qingjun Zheng, Export, PA (US);
Robert J. Vasinko, Latrobe, PA (US);
Yixiong Liu, Greensburg, PA (US);
Assignee:
KENNAMETAL INC., Latrobe, PA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C22C 19/05 (2006.01); B23K 1/19 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 35/32 (2006.01); B23K 35/36 (2006.01); B22F 7/08 (2006.01); C22C 1/10 (2006.01); C22C 32/00 (2006.01); C22C 29/04 (2006.01); C22C 29/14 (2006.01); C22C 29/16 (2006.01); C22C 33/02 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0008 (2013.01); B22F 7/08 (2013.01); B23K 1/19 (2013.01); B23K 35/0222 (2013.01); B23K 35/0233 (2013.01); B23K 35/0244 (2013.01); B23K 35/0255 (2013.01); B23K 35/30 (2013.01); B23K 35/3033 (2013.01); B23K 35/3046 (2013.01); B23K 35/3053 (2013.01); B23K 35/3066 (2013.01); B23K 35/327 (2013.01); B23K 35/36 (2013.01); B32B 15/01 (2013.01); B32B 15/013 (2013.01); C22C 1/1036 (2013.01); C22C 29/04 (2013.01); C22C 29/14 (2013.01); C22C 29/16 (2013.01); C22C 32/0047 (2013.01); C22C 33/0228 (2013.01); C22C 33/0242 (2013.01); C22C 33/0292 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); Y10T 428/12104 (2015.01);
Abstract
A composite wear pad includes a substrate that is selected from the group of iron based alloys, steel, nickel based alloys, and cobalt based alloys. A hard particle-matrix alloy layer is bonded at a surface to the substrate. The hard particle-matrix alloy layer has a plurality of hard particles dispersed in a matrix alloy. The hard particle-matrix alloy layer has a thickness ranging between greater than about 13 millimeters and about 20 millimeters.