The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Sep. 02, 2014
Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Sumitomo (Sei) Steel Wire Corp., Itami-shi, JP;

Inventors:

Kazuaki Sugimura, Itami, JP;

Hiromu Izumida, Itami, JP;

Kenichi Shimizu, Itami, JP;

Shinei Takamura, Itami, JP;

Katsutoshi Iwamoto, Itami, JP;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23H 7/24 (2006.01); B23H 7/08 (2006.01); C23C 2/06 (2006.01); C23C 2/38 (2006.01); B21C 1/02 (2006.01); C22C 18/02 (2006.01); B21C 1/00 (2006.01);
U.S. Cl.
CPC ...
B23H 7/24 (2013.01); B21C 1/003 (2013.01); B21C 1/02 (2013.01); B23H 7/08 (2013.01); C22C 18/02 (2013.01); C23C 2/06 (2013.01); C23C 2/38 (2013.01);
Abstract

An object of the present invention is to improve machining speed by realizing both conductive properties and discharge performance with regard to an electrode wire for wire electric discharge machining, the electrode wire being obtained by plating a steel wire with a copper-zinc alloy. Another object is to suppress the occurrence of separation, cracking, and the like of plating in a wire-drawing step of an electrode wire. An electrode wire for wire electric discharge machining of the present invention includes a steel wire () serving as a core wire, and a plating layer () that covers the steel wire and that is composed of a copper-zinc alloy, in which an average zinc concentration of the plating layer is 60% to 75% by mass, a conductivity of the plating layer is 10% to 20% IACS, and a wire diameter is 30 to 200 μm.


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