The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

May. 22, 2014
Applicant:

Src Labs, Llc, Chaska, MN (US);

Inventors:

Allan Jeffrey Koeppel, Colorado Springs, CO (US);

Douglas Cowles, Colorado Springs, CO (US);

Assignee:

Saint Regis Mohawk Tribe, Akwesasne, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/20 (2006.01); G06F 1/20 (2006.01); H05K 7/14 (2006.01); H05K 3/30 (2006.01); H05K 1/02 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20809 (2013.01); G06F 1/163 (2013.01); G06F 1/20 (2013.01); H05K 1/0203 (2013.01); H05K 3/30 (2013.01); H05K 7/1485 (2013.01); H05K 7/2039 (2013.01); H05K 7/20836 (2013.01); H05K 2201/10159 (2013.01); Y10T 29/49131 (2015.01);
Abstract

A system and method for thermally coupling memory devices, such as DIMM memory modules, to an associated memory controller such that both are cooled together at the same relative temperature. By maintaining all of the devices at a much more uniform temperature, memory timing issues are effectively eliminated. In accordance with an exemplary embodiment, the controller chip is physically located between two or more banks of memory, and is positioned under an adjoining heat sink while the memory DIMMs are positioned laterally of the controller chip in angled DIMM slots and are coupled to the controller chip with respective heat spreaders.


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