The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Jan. 25, 2015
Applicant:

Ebullient Llc, Madison, WI (US);

Inventors:

Timothy A. Shedd, Middleton, WI (US);

Brett A. Lindeman, Madison, WI (US);

Assignee:

EBULLIENT, INC., Madison, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 39/02 (2006.01); F25D 17/02 (2006.01); F25D 23/12 (2006.01); F25D 25/00 (2006.01); H05K 7/20 (2006.01); F25B 23/00 (2006.01); F25B 41/00 (2006.01); F28F 3/12 (2006.01); F28F 9/26 (2006.01); F28F 13/02 (2006.01); F28D 15/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20327 (2013.01); F25B 23/006 (2013.01); F25B 41/003 (2013.01); F28D 15/00 (2013.01); F28F 3/12 (2013.01); F28F 9/26 (2013.01); F28F 13/02 (2013.01);
Abstract

A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.


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