The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
May. 21, 2015
Schweizer Electronic Ag, Schramberg, DE;
Continental Automotive Gmbh, Hannover, DE;
Thomas Gottwald, Dunningen, DE;
Bernd Reisslöhner, Kaisheim, DE;
Thomas Rall, Dunningen Lackendorf, DE;
Roland Brey, Eschlkam, DE;
Gerald Hauer, Deuerling, DE;
Tobias Steckermeier, Pettendorf, DE;
SCHWEIZER ELECTRONIC AG, Schramberg, DE;
CONTINENTAL AUTOMOTIVE GMBH, Hannover, DE;
Abstract
A method of producing a printed circuit board () with a plurality of inlays (), having the following steps: supplying a plurality of inlays (), of which at least one inlay has at least one positioning element (to); building up a layer sequence from a plurality of printed-circuit-board layers, with at least one recess () for accommodating inlays, wherein, prior to the step of the plurality of inlays () being inserted, the recess () is defined in an uppermost layer () by a frame made of non-conductive printed-circuit-board material; inserting the plurality of inlays () into the recess () defined by the frame; covering the inlays () with a non-conductive printed-circuit-board material; laminating the layer sequence, and removing at least the positioning elements (to) which establish a conductive contact between neighboring inlays.