The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Jan. 22, 2016
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Kun-Ming Chen, Taoyuan, TW;

Chen-Chu Tsai, Taichung, TW;

Yuh-Zheng Lee, Hsinchu, TW;

Kuo-Lung Lo, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5256 (2013.01); H01L 51/5246 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01);
Abstract

A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.


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