The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9847462 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 19, 2017

Filed:

Oct. 28, 2014
Applicant:

Point Engineering Co., Ltd., Asan-si, Chungcheongnam-do, KR;

Inventors:

Ki Myung Nam, Cheonan-si, KR;

Seung Ho Park, Hwaseong-si, KR;

Young Chul Jun, Ansan-si, KR;

Assignee:

Point Engineering Co., Ltd., Asan-si, Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 24/97 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0033 (2013.01);
Abstract

Provided is an array substrate for mounting a chip. The array substrate includes a plurality of conductive layers unidirectionally stacked with respect to an original chip substrate; a plurality of insulating layers alternately stacked with the plurality of conductive layers, and electrically separate the plurality of conductive layers; and a cavity having a groove of a predetermined depth with respect to a region including the plurality of insulating layers in an upper surface of the original chip substrate. Accordingly, since the optical device array of a single structure is used as a line source of light, an emission angle emitted from the optical device is great, it is not necessary to form an interval for supplying an amount of light, and a display device can be simply constructed. Further, since it is not necessary to perform soldering a plurality of LED packages on a printed circuit board, a thickness of a back light unit can be reduced.


Find Patent Forward Citations

Nam, Ki. (2017). Array substrate for mounting chip and method for manufacturing the same (U.S. Patent No. 9847462). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9847462

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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