The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Nov. 18, 2016
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Sung Kyoon Kim, Seoul, KR;

Min Gyu Na, Seoul, KR;

Myeong Soo Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/40 (2010.01); H01L 33/62 (2010.01); H01L 33/12 (2010.01); H01L 33/06 (2010.01); H01L 33/42 (2010.01); H01L 33/14 (2010.01); H01L 33/30 (2010.01); H01L 33/08 (2010.01);
U.S. Cl.
CPC ...
H01L 33/387 (2013.01); H01L 33/06 (2013.01); H01L 33/08 (2013.01); H01L 33/12 (2013.01); H01L 33/145 (2013.01); H01L 33/30 (2013.01); H01L 33/382 (2013.01); H01L 33/385 (2013.01); H01L 33/405 (2013.01); H01L 33/42 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01);
Abstract

Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package and a lighting system. The light emitting device includes a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; a contact layer on the second conductive semiconductor layer; an insulating layer on the contact layer; a first branch electrode electrically connected to the first conductive semiconductor layer; a plurality of first via electrodes connected to the first branch electrode and electrically connected to the first conductive semiconductor layer by passing through the insulating layer; a first pad electrode electrically connected to the first branch electrode; a second pad electrode contacts the contact layer by passing through the insulating layer; a second branch electrode connected to the second pad electrode and disposed on the insulating layer; and a plurality of second via electrodes provided through provided through the insulating layer to electrically connect the second branch electrode to the contact layer.


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