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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9847454 B1

PDFFull Text
Date of Patent:
Dec. 19, 2017

Filed:

Oct. 02, 2015

Light-emitting device

Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Kuo-Feng Huang, Hsinchu, TW;

Cheng-Hsing Chiang, Hsinchu, TW;

Jih-Ming Tu, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:

Ditthavong & Steiner, P.C.

Primary Examiner:

Bac Au

Int. Cl.
CPC ...
H01L 33/22 (2010.01); H01L 33/30 (2010.01); H01L 33/00 (2010.01); H01L 33/02 (2010.01); H01L 33/06 (2010.01); H01L 33/14 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/30 (2013.01); H01L 33/0062 (2013.01); H01L 33/025 (2013.01); H01L 33/06 (2013.01); H01L 33/14 (2013.01); H01L 33/22 (2013.01); H01L 33/38 (2013.01); H01L 2933/0083 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A light-emitting device is provided. The light-emitting device comprises a light-emitting stack comprising a first semiconductor layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second semiconductor layer. The light-emitting device further comprises a third semiconductor layer on the light-emitting stack and comprising a first sub-layer, a second sub-layer and a roughened surface, wherein the first sub-layer has the same composition as that of the second sub-layer, and the composition of the first sub-layer is with a different atomic ratio from that of the second sub-layer. A method for manufacturing the light-emitting device is also provided.

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