The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Mar. 29, 2013
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventor:

Frank Wei, Eindhoven, NL;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 33/0079 (2013.01); H01L 33/507 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01);
Abstract

LED dies are partially singulated while on an unthinned depth growth substrate. Slots are made through the streets separating the LED dies, but not through the growth substrate, leaving the now separated LED dies on the growth substrate. A secondary support is attached to the LED dies on the opposite surface from the growth substrate, and the growth substrate is thinned or removed, leaving the LED dies on the secondary support. Because the LED dies are separated while on the unthinned growth substrate, the likelihood of distortion before slicing is virtually eliminated, and the width of the streets between the LED dies may be correspondingly reduced.


Find Patent Forward Citations

Wei, Frank. (2017). Led thin-film device partial singulation prior to substrate thinning or removal (U.S. Patent No. 9847445). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9847445

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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