The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
Dec. 04, 2015
Applicant:
Stmicroelectronics (Crolles 2) Sas, Crolles, FR;
Inventor:
Nicolas Hotellier, Jarrie, FR;
Assignee:
STMicroelectronics (Crolles 2) SAS, Crolles, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/18 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 21/76898 (2013.01); H01L 27/1464 (2013.01); H01L 27/14687 (2013.01); H01L 27/14689 (2013.01); H01L 31/1892 (2013.01); H01L 27/14643 (2013.01);
Abstract
An electronic component includes a semiconductor layer having a first surface coated with a first insulating layer and a second surface coated with an interconnection structure. A laterally insulated conductive pin extends through the semiconductor layer from a portion of conductive layer of the interconnection structure all the way to a contact pad arranged at the level of the first insulating layer.