The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Sep. 16, 2016
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Satoshi Nagashima, Yokkaichi, JP;

Katsumi Yamamoto, Yokkaichi, JP;

Kohei Sakaike, Yokkaichi, JP;

Tatsuya Kato, Yokkaichi, JP;

Keisuke Kikutani, Yokkaichi, JP;

Fumitaka Arai, Yokkaichi, JP;

Atsushi Murakoshi, Yokkaichi, JP;

Shunichi Takeuchi, Kawasaki, JP;

Katsuyuki Sekine, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/788 (2006.01); H01L 27/11556 (2017.01); H01L 29/51 (2006.01); H01L 27/11521 (2017.01); H01L 29/06 (2006.01); H01L 21/31 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11556 (2013.01); H01L 21/31 (2013.01); H01L 27/11521 (2013.01); H01L 29/0649 (2013.01); H01L 29/513 (2013.01); H01L 21/306 (2013.01);
Abstract

A semiconductor memory device includes a first structural body, a second structural body and interconnections. The first and the second structural bodies are separated in a first direction and extend in a second direction. The interconnections are provided between the first structural body and the second structural body, extend in the second direction, and are separated from each other along a third direction. The first and the second structural bodies each includes an insulating member, a column-shaped body and an insulating film. The insulating member and the column-shaped body are disposed in an alternating manner along the second direction and extend in the third direction. The insulating members of the first and second structural bodies make contact with the interconnections.


Find Patent Forward Citations

Loading…