The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
Jul. 22, 2016
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventors:
Matthew B. Wasserman, Philadelphia, PA (US);
Michael P. Schmidt-Lange, North Wales, PA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 23/00 (2006.01); B23K 3/08 (2006.01); B23K 37/00 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 3/02 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 3/02 (2013.01); B23K 3/08 (2013.01); B23K 3/085 (2013.01); B23K 37/003 (2013.01); H01L 24/81 (2013.01); B23K 2201/42 (2013.01); H01L 2224/755 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/81203 (2013.01);
Abstract
A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.