The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Apr. 18, 2014
Applicant:

Halliburton Energy Services, Inc., Houston, TX (US);

Inventor:

Oleg Bondarenko, Spring, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/32 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/32 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/49861 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H01L 2224/16055 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81191 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H05K 3/3426 (2013.01); H05K 3/3436 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An example method for attaching a ball grid array chip to a circuit board includes providing an adapter for attaching a chip with a plurality of solder balls to a circuit board, the adapter having an adapter substrate made from a material having substantially the same coefficient of thermal expansion as the substrate used in the chip and having at least one electrical contact site on a mounting surface of the adapter substrate for engaging a solder ball on the ball grid array chip and a plurality of lead wires extending from each side of the adapter substrate. At least one of the lead wires is electrically connected to at least one electrical contact site on the adapter substrate.


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Bondarenko, Oleg. (2017). High-temperature cycling bga packaging (U.S. Patent No. 9847286). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9847286

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