The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
Oct. 27, 2016
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Yohei Miura, Kawasaki, JP;
Yasushi Masuda, Kawasaki, JP;
Satoshi Ohsawa, Kawasaki, JP;
Yoshihiro Morita, Yokohama, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 31/024 (2014.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); G02B 6/42 (2013.01); H01L 23/3128 (2013.01); H01L 23/3677 (2013.01); H01L 31/024 (2013.01);
Abstract
A semiconductor device includes: a processor having a heat sink mounted thereon; and an optical module having a heat transfer interposer, wherein the heat sink and the optical module are coupled to each other via the heat transfer interposer. And a semiconductor device includes: a semiconductor chip mounted on a substrate; a lead that covers the semiconductor chip; a heat sink installed on the lead; and an optical module coupled to the heat sink via a heat transfer interposer.