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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9847267 B1

PDFFull Text
Date of Patent:
Dec. 19, 2017

Filed:

Nov. 18, 2014

Electronic component housing package and electronic apparatus

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Noritaka Niino, Kyoto, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Binh Tran

Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/18 (2006.01); H01L 23/053 (2006.01); H01L 23/057 (2006.01); H01L 23/10 (2006.01); H01L 21/50 (2006.01); H03H 9/10 (2006.01); H01L 23/08 (2006.01); H01L 41/053 (2006.01); H05K 9/00 (2006.01); H05K 5/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 21/50 (2013.01); H01L 23/057 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 41/053 (2013.01); H03H 9/1014 (2013.01); H03H 9/1071 (2013.01); H05K 1/183 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/16195 (2013.01); H05K 1/0218 (2013.01); H05K 1/0224 (2013.01); H05K 9/0024 (2013.01); H05K 9/0052 (2013.01); H05K 9/0071 (2013.01); H05K 9/0098 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10371 (2013.01);
Abstract

An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

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