The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Aug. 27, 2009
Applicants:

Alain Robert Emile Carre, Le Chatelet-en-Brie, FR;

Sean Matthew Garner, Elmira, NY (US);

Jean Waku-nsimba, La Brosse-Montceaux, FR;

Inventors:

Alain Robert Emile Carre, Le Chatelet-en-Brie, FR;

Sean Matthew Garner, Elmira, NY (US);

Jean Waku-Nsimba, La Brosse-Montceaux, FR;

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/02 (2006.01); H01L 21/683 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); B32B 43/006 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68395 (2013.01); H01L 2924/19041 (2013.01);
Abstract

A process for making a device comprising a thin functional substrate comprising bonding the functional substrate to a carrier substrate, forming functional components on the functional subsrate, and debonding the functional substrate from the carrier substrate by applying ultrasonic wave to the bonding interface. The application of ultrasonic wave aids the debonding step by reducing the tensile stress the functional substrate may experience.


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